KA HOIKE ELECTROPLATING
| Māhele Hoʻouhi | Hoʻopau i ka hoʻopōkole | kala kala | Mānoanoa uhi | Hoʻohālikelike i ka hiki ke pale aku i ka ʻili o Coating | Manaʻo Hoʻohana Mahana | ʻAha ʻili | ||
| ʻO ka hoʻāʻo ʻana i ka paʻakai ʻole | Ho'āʻo wela haʻahaʻa | Ho'āʻo PCT | ||||||
| Ni/Barrel Plating | Ni | Kālā ʻālohilohi | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| Ni/Rack Plating | Ni | Kālā ʻālohilohi | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| 3+Cr Zn/Blue-White Zn/Paʻa Paʻa | Zn | Polū&keʻokeʻo | 5-10 | ☆☆☆☆ | ☆☆☆ | ☆☆☆ | ≤160 | 38 |
| 3+Cr Zn/Blue-White Zn/Rack Plating | Zn | Polū&keʻokeʻo | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| 3+Cr waihoʻoluʻu Zn / Barrel Plating | kala Zn | kala ʻulaʻula | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| 3+Cr kala Zn/Rack Plating | kala Zn | kala ʻulaʻula | 5-10 | ☆☆☆ | ☆☆☆ | ☆☆☆ | ||
| Ni+Kemika Ni Barrel Plating | Ni+Kemika Ni | kālā ʻeleʻele | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤200 | 36 |
| ʻO Ni+Kemika Ni Rack Plating | Ni+Kemika Ni | kālā ʻeleʻele | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ||
| Ni+Cr | Ni+Cr | ʻeleʻele ʻeleʻele | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ≤260 | 36 |
| Teflon | Teflon | ʻeleʻele hina |
| ☆☆☆ | ☆☆☆ | ☆☆☆ | ≤260 | 36 |
| Ni+ʻeleʻele Ni | Ni+ʻeleʻele Ni | ʻeleʻele | 12-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | ||
| Ni+Sn | Ni+Sn | Kālā ʻālohilohi | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Ni+Ag | Ni+Ag | Kālā kala | 12-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Ni+Au | Ni+Au | gula | 10-20 | ☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆☆ | - | 36 |
| Epoxy | EPOXY | ʻeleʻele | 10-20 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆☆ | ≤160 | 36 |
| Ni/NiCu+Epoxy | NiCuNi/NiCu+EPOXY | ʻeleʻele | 15-25 | ☆☆☆☆☆ | ☆☆☆☆☆ | ☆☆☆ | ≤160 | 36 |
| Passivation/Phosphatization | Phosphoric/Passivation | ʻeleʻele hina | 1-3 | — | — | — | ≤240 | 37 |
| Kāuhi Nano | Ka uhi Nano | ʻAhinahina māmā | 15-30 | ☆☆☆☆☆☆ | ☆☆☆☆☆☆ | ☆☆☆☆☆☆☆ | ≤300 | 33 |
OLELO HOOLAHA
1. Kaiapuni SST: 35±2 ℃,5%NaCl,PH=6.5-7.2,Paʻakai paʻakai e poho ana 1.5ml/Hr.
2. PCT Kaiapuni: 120±3 ℃,2-2.4atm, wai hoʻoheheʻe PH=6.7-7.2 , 100% RH
E ʻoluʻolu e hoʻokaʻaʻike mai iā mākou no nā noi kūikawā